Sony is said to be working on a tweaked PlayStation 5 console that will be released in 2023 and will include a tweaked semi-custom AMD APU built on TSMC’s latest 6nm node.
The new semi-custom APU will also have the same Zen 2 CPU cores and RDNA 2 GPU cores as the PlayStation 5, but the chip will be made on TSMC’s new N6 (6nm) process relative to the N7 (7nm) process that the PS5 and Xbox Series X/S chips are manufactured on.
Digitimes is behind the study teasing that Sony should not reinvent the physical appearance and style of the PS5, but rather the system-on-Chip on the 6nm node. Siliconware Precision Industries (SPIL), a member of the ASE Technology Holding, and Tongfu Microelectronics continue their mission in the field of Sony assemply partners chip packaging services — yet there has not yet been any official statement about the tweaked PS5.
What is the latest 6nm process technology more mature now? N6 represents a development of TSMC’s 7nm node with the same rules on construction. This means it is not difficult for enterprises, such as Sony, to hop in 6nm and pump new chips for TSMC.
TSMC states that latest N6 technologies, which delivers the same power and output, have an 18% higher logical density over the N7 process. TSMC said that N6 ‘takes the most out of the recent ability of N7+ extreme ultraviolet lithography (EUVL) to re-use the same design ecosystem.
For Sony it is ideal because it saves them the retool as “hey TSMC, so this 6nm method… yeah…you guys, uh… can’t make our PS5 semi-custom APUs on it?”? And Your Uncle’s Bob.
The new N6 process from TSMC should be ready for mass production later this year and in the near future could be used in some tweaked next generation consoles in the PlayStation 5 and Xbox Series X/S.